Invention Grant
- Patent Title: Selective inhibition in atomic layer deposition of silicon-containing films
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Application No.: US15399637Application Date: 2017-01-05
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Publication No.: US09875891B2Publication Date: 2018-01-23
- Inventor: Jon Henri , Dennis M. Hausmann , Bart J. van Schravendijk , Shane Tang , Karl F. Leeser
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/455 ; C23C16/50 ; C23C16/52

Abstract:
Methods of selectively inhibiting deposition of silicon-containing films deposited by atomic layer deposition are provided. Selective inhibition involves exposure of an adsorbed layer of a silicon-containing precursor to a hydrogen-containing inhibitor, and in some instances, prior to exposure of the adsorbed layer to a second reactant. Exposure to a hydrogen-containing inhibitor may be performed with a plasma, and methods are suitable for selective inhibition in thermal or plasma enhanced atomic layer deposition of silicon-containing films.
Public/Granted literature
- US20170117134A1 SELECTIVE INHIBITION IN ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FILMS Public/Granted day:2017-04-27
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