Invention Grant
- Patent Title: Middle of the line integrated efuse in trench EPI structure
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Application No.: US15366296Application Date: 2016-12-01
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Publication No.: US09881869B2Publication Date: 2018-01-30
- Inventor: Hong He , Juntao Li , Junli Wang , Chih-Chao Yang
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Tutunjian & Bitetto, P.C.
- Agent Vazken Alexanian
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/525 ; H01L21/768 ; H01L23/532

Abstract:
A fuse includes a semiconductor layer having a dielectric material formed thereon. An epitaxially grown material is formed in a trench within the dielectric material. The epitaxially grown material includes a peak region. A fuse metal is formed over the peak region and extends along sidewalls of the trench and over the dielectric material outside the trench. Contacts are formed outside the trench connecting to fuse metal over the dielectric material.
Public/Granted literature
- US20170170116A1 MIDDLE OF THE LINE INTEGRATED EFUSE IN TRENCH EPI STRUCTURE Public/Granted day:2017-06-15
Information query
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