Invention Grant
- Patent Title: Electronic packages with three-dimensional conductive planes, and methods for fabrication
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Application No.: US15304858Application Date: 2015-04-20
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Publication No.: US09881905B2Publication Date: 2018-01-30
- Inventor: Eric Paul Vick , Dorota Temple
- Applicant: Research Triangle Institute
- Applicant Address: US NC Research Triangle Park
- Assignee: Research Triangle Institute
- Current Assignee: Research Triangle Institute
- Current Assignee Address: US NC Research Triangle Park
- Agency: Olive Law Group, PLLC
- International Application: PCT/US2015/026682 WO 20150420
- International Announcement: WO2015/164266 WO 20151029
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/48 ; H01L25/00
Abstract:
An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.
Public/Granted literature
- US20170207198A1 ELECTRONIC PACKAGES WITH THREE-DIMENSIONAL CONDUCTIVE PLANES, AND METHODS FOR FABRICATION Public/Granted day:2017-07-20
Information query
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