公开(公告)号：US09881905B2

公开(公告)日：2018-01-30

申请号：US15304858

申请日：2015-04-20

Applicant: Research Triangle Institute

Inventor： Eric Paul Vick ,  Dorota Temple

IPC: H01L25/065 ,  H01L23/48 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/24 ,  H01L24/25 ,  H01L24/29 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/24051 ,  H01L2224/24105 ,  H01L2224/24146 ,  H01L2224/244 ,  H01L2224/245 ,  H01L2224/2511 ,  H01L2224/32145 ,  H01L2224/83191 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/92144 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06531 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01022 ,  H01L2224/83 ,  H01L2224/82

Abstract: An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.

公开(公告)号：US20150187691A1

公开(公告)日：2015-07-02

申请号：US14408887

申请日：2013-06-25

Applicant: Research Triangle Institute

Inventor： Eric Paul Vick

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/768

CPC classification number: H01L23/49827 ,  H01L21/02107 ,  H01L21/76898 ,  H01L24/24 ,  H01L24/29 ,  H01L24/80 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L24/95 ,  H01L25/0657 ,  H01L25/162 ,  H01L25/50 ,  H01L2224/24146 ,  H01L2224/2919 ,  H01L2224/80203 ,  H01L2224/8036 ,  H01L2224/80896 ,  H01L2224/82031 ,  H01L2224/821 ,  H01L2224/83203 ,  H01L2224/8336 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/9212 ,  H01L2224/92144 ,  H01L2224/94 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/0665 ,  H01L2924/0675 ,  H01L2924/07025 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/80001 ,  H01L2224/82 ,  H05K3/4661 ,  H01L2224/83

Abstract: An electronic package may be fabricated by forming a first layer of insulating material on a first substrate such that the first layer covers a contact pad; forming an opening through the first layer to expose the contact pad; forming an un-patterned second layer on the first layer, the second layer including an adhesive having a viscosity less than that of the first layer, wherein a region of the second layer obstructs the contact pad; removing the region to re-expose the contact pad; aligning a second substrate with the first substrate such that a via of the second substrate is aligned with the opening; bonding the first substrate and the second substrate together at the second layer; and forming an interconnect in contact with the contact pad by depositing a conductive material through the via and the opening.

Abstract translation: 可以通过在第一基板上形成第一绝缘材料层来制造电子封装，使得第一层覆盖接触垫; 通过所述第一层形成开口以暴露所述接触垫; 在所述第一层上形成未图案化的第二层，所述第二层包括粘度小于所述第一层粘度的粘合剂，其中所述第二层的区域阻碍所述接触垫; 去除区域以重新暴露接触垫; 将第二基板与第一基板对准，使得第二基板的通孔与开口对准; 在第二层将第一基板和第二基板接合在一起; 以及通过通过所述通孔和所述开口沉积导电材料来形成与所述接触焊盘接触的互连。