Invention Grant
- Patent Title: FinFET with merged, epitaxial source/drain regions
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Application No.: US14981869Application Date: 2015-12-28
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Publication No.: US09882054B2Publication Date: 2018-01-30
- Inventor: En-Chiuan Liou , Yu-Cheng Tung
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: TW104137271A 20151112
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/08 ; H01L29/06 ; H01L29/16 ; H01L29/161 ; H01L29/165 ; H01L21/306 ; H01L29/66 ; H01L21/768 ; H01L21/02

Abstract:
A FinFET is provided. The FinFET includes a substrate. A plurality of fin structures are defined on the substrate. A gate structure crosses each fin structure. Two first recesses are disposed on two sides of the gate structure respectively, wherein each first recess further includes a plurality of second recesses disposed therein, and the position of each second recess corresponds to each fin structure. Two epitaxial layers are disposed at two sides of the gate structure respectively and in the first recesses, each epitaxial layer has a bottom surface including a second concave and convex profile, and each epitaxial layer directly contacts a bottom surface of each first recess and a bottom surface of each second recess.
Public/Granted literature
- US20170141221A1 FINFET AND METHOD OF FABRICATING THE SAME Public/Granted day:2017-05-18
Information query
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