An integrated circuit (IC) die and integrated circuit (IC) chip packages having such dies are described that leverage the symmetry of the arrangement of micro-bumps to advantageously reduce interposer cost and size requirements. In one example, an integrated circuit (IC) die is provided. The IC die includes a die body, a plurality of programmable tiles disposed in the die body, and a plurality of micro-bumps disposed in the die body. The die body includes a front face connecting a bottom exterior surface and a top exterior surface. A centerline of the die body is perpendicular to the front face and bifurcates the top exterior surface. At least two of the programmable tiles are of a common type. The micro-bumps adjacent the front face and coupled to the common type of programmable tiles have a substantially symmetrical orientation relative to a symmetry axis. The symmetry axis being one of (a) collinear with the centerline of the die body, or (b) parallel to the centerline of the die body.