Invention Grant
- Patent Title: Electronic package and semiconductor substrate
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Application No.: US15084762Application Date: 2016-03-30
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Publication No.: US09899309B2Publication Date: 2018-02-20
- Inventor: Shih-Ching Chen , Shih-Liang Peng , Chieh-Lung Lai , Jia-Wei Pan , Chang-Lun Lu
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW105106680A 20160304
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/48 ; H01L29/02 ; H01L25/065 ; H01L23/498 ; H01L23/31 ; H01L25/16 ; H01L21/48
Abstract:
A semiconductor substrate is provided, including a substrate body having a lateral surface, and a protruding structure extending outward from the lateral surface. The semiconductor substrate distributes stresses generated during a manufacturing process through the protruding structure, and is thus prevented from delamination or being cracked. An electronic package having the semiconductor substrate is also provided.
Public/Granted literature
- US20170256481A1 ELECTRONIC PACKAGE AND SEMICONDUCTOR SUBSTRATE Public/Granted day:2017-09-07
Information query
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