公开(公告)号：US20210280530A1

公开(公告)日：2021-09-09

申请号：US16876460

申请日：2020-05-18

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chi-Jen Chen ,  Chih-Hsun Hsu ,  Chee-Key Chung ,  Jia-Wei Pan ,  Chang-Fu Lin

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/31 ,  H01L23/498

Abstract: Provided is an electronic package, including a multi-chip packaging body with a plurality of electronic elements and a stress buffer layer disposed on the multi-chip packaging body. The stress buffer layer is in contact with the plurality of electronic elements so as to cause stresses to be evenly distributed in the stress buffer layer instead of being concentrated in specific areas, thereby preventing structural stresses from being concentrated in corners of the electronic elements.

公开(公告)号：US09899309B2

公开(公告)日：2018-02-20

申请号：US15084762

申请日：2016-03-30

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shih-Ching Chen ,  Shih-Liang Peng ,  Chieh-Lung Lai ,  Jia-Wei Pan ,  Chang-Lun Lu

IPC: H01L23/00 ,  H01L23/48 ,  H01L29/02 ,  H01L25/065 ,  H01L23/498 ,  H01L23/31 ,  H01L25/16 ,  H01L21/48

CPC classification number: H01L21/4846 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/562 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/15151

Abstract: A semiconductor substrate is provided, including a substrate body having a lateral surface, and a protruding structure extending outward from the lateral surface. The semiconductor substrate distributes stresses generated during a manufacturing process through the protruding structure, and is thus prevented from delamination or being cracked. An electronic package having the semiconductor substrate is also provided.

公开(公告)号：US20170256481A1

公开(公告)日：2017-09-07

申请号：US15084762

申请日：2016-03-30

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shih-Ching Chen ,  Shih-Liang Peng ,  Chieh-Lung Lai ,  Jia-Wei Pan ,  Chang-Lun Lu

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L25/16 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L21/4846 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/562 ,  H01L24/17 ,  H01L25/0655 ,  H01L25/16 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/15151

Abstract: A semiconductor substrate is provided, including a substrate body having a lateral surface, and a protruding structure extending outward from the lateral surface. The semiconductor substrate distributes stresses generated during a manufacturing process through the protruding structure, and is thus prevented from delamination or being cracked. An electronic package having the semiconductor substrate is also provided.