Invention Grant
- Patent Title: Semiconductor device and method of forming the same
-
Application No.: US15182620Application Date: 2016-06-15
-
Publication No.: US09899491B2Publication Date: 2018-02-20
- Inventor: Po-Wen Su , Zhen Wu , Hsiao-Pang Chou , Chiu-Hsien Yeh , Shui-Yen Lu , Jian-Wei Chen
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: TW105115025A 20160516
- Main IPC: H01L29/51
- IPC: H01L29/51 ; H01L21/82 ; H01L27/088 ; H01L29/66 ; H01L29/40 ; H01L21/8234 ; H01L29/423

Abstract:
A semiconductor device and a method of forming the same, the semiconductor device include a substrate, and a first gate structure and a second gate structure disposed on the substrate. The first gate structure includes a barrier layer, a first work function layer, a second work function layer and a conductive layer stacked one over another on the substrate. The second gate structure includes the barrier layer, a portion of the first work function layer and the conductive layer stacked one over another on the substrate, wherein the portion of the first work function layer has a smaller thickness than a thickness of the first work function layer.
Public/Granted literature
- US20170330952A1 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME Public/Granted day:2017-11-16
Information query
IPC分类: