Invention Grant
- Patent Title: Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions
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Application No.: US15048877Application Date: 2016-02-19
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Publication No.: US09905691B2Publication Date: 2018-02-27
- Inventor: Daniel E. Grupp , Daniel J. Connelly
- Applicant: Acorn Technologies, Inc.
- Applicant Address: US CA La Jolla
- Assignee: Acorn Technologies, Inc.
- Current Assignee: Acorn Technologies, Inc.
- Current Assignee Address: US CA La Jolla
- Agency: Ascenda Law Group, PC
- Main IPC: H01L29/51
- IPC: H01L29/51 ; H01L21/31 ; H01L29/78 ; H01L29/872 ; H01L29/16 ; H01L29/161
Abstract:
An electrical device in which an interface layer is disposed in between and in contact with a conductor and a semiconductor.
Public/Granted literature
Information query
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