Invention Grant
- Patent Title: Through-body-via isolated coaxial capacitor and techniques for forming same
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Application No.: US15038623Application Date: 2013-12-23
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Publication No.: US09911689B2Publication Date: 2018-03-06
- Inventor: Kevin J. Lee , Ruchir Saraswat , Uwe Zillmann , Nicholas P. Cowley , Andre Schaefer , Rinkle Jain , Guido Droege
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Finch & Maloney PLLC
- International Application: PCT/US2013/077559 WO 20131223
- International Announcement: WO2015/099668 WO 20150702
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/522 ; H01L21/768 ; H01L49/02 ; H01L25/065 ; H01L23/48 ; H01L21/822 ; H01L23/492 ; H01L23/498 ; H01L27/06

Abstract:
Techniques are disclosed for forming a through-body-via (TBV) isolated coaxial capacitor in a semiconductor die. In some embodiments, a cylindrical capacitor provided using the disclosed techniques may include, for example, a conductive TBV surrounded by a dielectric material and an outer conductor plate. The TBV and outer plate can be formed, for example, so as to be self-aligned with one another in a coaxial arrangement, in accordance with some embodiments. The disclosed capacitor may extend through the body of a host die such that its terminals are accessible on the upper and/or lower surfaces thereof. Thus, in some cases, the host die can be electrically connected with another die to provide a die stack or other three-dimensional integrated circuit (3D IC), in accordance with some embodiments. In some instances, the disclosed capacitor can be utilized, for example, to provide integrated capacitance in a switched-capacitor voltage regulator (SCVR).
Public/Granted literature
- US20170040255A1 THROUGH-BODY-VIA ISOLATED COAXIAL CAPACITOR AND TECHNIQUES FOR FORMING SAME Public/Granted day:2017-02-09
Information query
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