- 专利标题: Semiconductor device containing HEMT and MISFET and method of forming the same
-
申请号: US15224263申请日: 2016-07-29
-
公开(公告)号: US09911734B2公开(公告)日: 2018-03-06
- 发明人: Chung-Yen Chou , Sheng-De Liu , Fu-Chih Yang , Shih-Chang Liu , Chia-Shiung Tsai
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Slater Matsil, LLP
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L29/66 ; H01L29/51 ; H01L29/778 ; H01L29/10 ; H01L29/20 ; H01L21/8252 ; H01L27/06 ; H01L27/085
摘要:
A semiconductor structure with a MISFET and a HEMT region includes a first III-V compound layer. A second III-V compound layer is disposed on the first III-V compound layer and is different from the first III-V compound layer in composition. A third III-V compound layer is disposed on the second III-V compound layer is different from the second III-V compound layer in composition. A source feature and a drain feature are disposed in each of the MISFET and HEMT regions on the third III-V compound layer. A gate electrode is disposed over the second III-V compound layer between the source feature and the drain feature. A gate dielectric layer is disposed under the gate electrode in the MISFET region but above the top surface of the third III-V compound layer.
公开/授权文献
信息查询
IPC分类: