- Patent Title: Resin composition for sealing organic electroluminescent element, sealing film for organic electroluminescent element, gas-barrier film for organic electroluminescent element, and organic electroluminescent element using these films
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Application No.: US14566961Application Date: 2014-12-11
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Publication No.: US09913324B2Publication Date: 2018-03-06
- Inventor: Naoaki Mihara , Kunihiko Ishiguro , Toshimitsu Nakamura , Tetsuya Mieda
- Applicant: FURUKAWA ELECTRIC CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2012-136423 20120615
- Main IPC: B32B27/36
- IPC: B32B27/36 ; H05B33/00 ; H05B33/04 ; C08J5/18 ; C08G59/72 ; C08L67/02 ; C08G59/24 ; H01L51/52
Abstract:
A resin composition for sealing an organic electroluminescent element, containing: at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, in which the content of the epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the polyester resin.
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