公开(公告)号：US09913324B2

公开(公告)日：2018-03-06

申请号：US14566961

申请日：2014-12-11

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Naoaki Mihara ,  Kunihiko Ishiguro ,  Toshimitsu Nakamura ,  Tetsuya Mieda

IPC: B32B27/36 ,  H05B33/00 ,  H05B33/04 ,  C08J5/18 ,  C08G59/72 ,  C08L67/02 ,  C08G59/24 ,  H01L51/52

CPC classification number: H05B33/04 ,  B32B27/36 ,  C08G59/24 ,  C08G59/72 ,  C08J5/18 ,  C08L67/02 ,  H01L51/5253 ,  Y10T428/31511 ,  C08L63/00

Abstract: A resin composition for sealing an organic electroluminescent element, containing: at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, in which the content of the epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the polyester resin.

公开(公告)号：US10043996B2

公开(公告)日：2018-08-07

申请号：US14868088

申请日：2015-09-28

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Masami Aoyama ,  Tetsuya Mieda ,  Keiji Saito ,  Kunihiko Ishiguro ,  Toshimitsu Nakamura ,  Naoaki Mihara ,  Takumi Asanuma

IPC: H01L51/52 ,  H01L51/00 ,  C08L65/00

Abstract: Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.

公开(公告)号：US09758690B2

公开(公告)日：2017-09-12

申请号：US14750577

申请日：2015-06-25

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Kunihiko Ishiguro ,  Tetsuya Mieda ,  Keiji Saito ,  Masami Aoyama ,  Toshimitsu Nakamura ,  Naoaki Mihara ,  Takumi Asanuma

IPC: C09D125/08 ,  C09D193/04 ,  C09D109/06 ,  C09D123/22 ,  C08K5/01 ,  C08K5/56 ,  C08K5/057 ,  C08K5/00 ,  C08L53/02 ,  H01L51/52

CPC classification number: C09D125/08 ,  C08K5/0091 ,  C08K5/01 ,  C08K5/057 ,  C08K5/07 ,  C08K5/56 ,  C08L53/025 ,  C08L57/02 ,  C09D109/06 ,  C09D123/22 ,  C09D193/04 ,  H01L51/524

Abstract: A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y

公开(公告)号：US09257671B2

公开(公告)日：2016-02-09

申请号：US14303034

申请日：2014-06-12

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Toshihiro Suzuki ,  Satoshi Hattori ,  Tetsuya Mieda ,  Hideto Fukuda ,  Takanori Yamakawa ,  Toshimitsu Nakamura

IPC: H01L21/48 ,  H01L23/02 ,  H01L51/52 ,  H05B33/04 ,  H05B33/10

CPC classification number: H01L51/5253 ,  H01L51/5246 ,  H01L51/5259 ,  H05B33/04 ,  H05B33/10 ,  Y10T428/1476

Abstract: A resin composition for sealing an organic electroluminescent device, containing: a drying agent, and a curable component, wherein a surface roughness Ra of the shear failure surface after curing the resin composition is 0.5 μm or more; a production method thereof; an adhesive film and a gas-barrier formed of the resin composition; an organic electroluminescent device and an organic electroluminescent panel using the same.

Abstract translation: 一种用于密封有机电致发光器件的树脂组合物，其包含：干燥剂和可固化组分，其中固化所述树脂组合物后的剪切破坏表面的表面粗糙度Ra为0.5μm以上; 其制造方法; 由所述树脂组合物形成的粘合膜和阻气层; 有机电致发光器件和使用其的有机电致发光器件。

公开(公告)号：US20150291824A1

公开(公告)日：2015-10-15

申请号：US14750577

申请日：2015-06-25

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Kunihiko ISHIGURO ,  Tetsuya Mieda ,  Keiji Saito ,  Masami Aoyama ,  Toshimitsu Nakamura ,  Naoaki Mihara ,  Takumi Asanuma

IPC: C09D125/08 ,  C08K5/56 ,  C09D123/22 ,  C08K5/01 ,  C09D193/04 ,  C09D109/06

CPC classification number: C09D125/08 ,  C08K5/0091 ,  C08K5/01 ,  C08K5/057 ,  C08K5/07 ,  C08K5/56 ,  C08L53/025 ,  C08L57/02 ,  C09D109/06 ,  C09D123/22 ,  C09D193/04 ,  H01L51/524

Abstract: A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y

Abstract translation: 提供了一种用于密封有机EL元件的透明树脂组合物和具有足够的阻止水分和优异柔性的效果的其它物质。 作为必需成分，含有以下化学式表示的热塑性树脂，增粘树脂和有机金属化合物，其透光率为85％以上，并且具有AM / Y <162的关系，A：除 有机金属化合物M：有机金属化合物的重均分子量Y：有机金属化合物相对于100重量份树脂成分的重量比，其中热塑性树脂含有苯乙烯基ABA型三嵌段的氢化物，其中R1 R 4表示碳原子数为1以上8以下的烷基，芳基，烷氧基，环烷基，酰基等有机基团，M表示3价的金属原子。