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公开(公告)号：US10043996B2
公开(公告)日：2018-08-07
申请号：US14868088
申请日：2015-09-28
发明人： Masami Aoyama , Tetsuya Mieda , Keiji Saito , Kunihiko Ishiguro , Toshimitsu Nakamura , Naoaki Mihara , Takumi Asanuma
摘要： Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.
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公开(公告)号：US09793511B2
公开(公告)日：2017-10-17
申请号：US15190833
申请日：2016-06-23
IPC分类号： H01L21/00 , H01L21/47 , H01L21/54 , H01L21/56 , H01L51/52 , H01L51/00 , C08K5/057 , C08L23/22 , H01L51/56
CPC分类号： H01L51/5253 , C08K5/057 , C08L23/22 , H01L51/004 , H01L51/0081 , H01L51/524 , H01L51/56 , H01L2251/5369
摘要： A filler material for an organic electroluminescent element, formed of a resin composition being liquid at 25° C., and containing a hydrocarbon polymer having a number average molecular weight of 300 or more and less than 32,000 and an organometallic compound represented by M-Ln (wherein, M represents a metal atom; L represents an organic group having 9 or more carbon atoms and 1 or more oxygen atoms, and all of L represent the same organic group; and n represents the valence of a metal atom M), wherein a contact angle to silicon nitride is 10 to 40 degrees, and an amount of outgassing other than moisture upon heating at 85° C. for 1 hour is 500 ppm or less in terms of a toluene equivalent, and a method of sealing an organic electroluminescent element using the same.
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公开(公告)号：US09758690B2
公开(公告)日：2017-09-12
申请号：US14750577
申请日：2015-06-25
发明人： Kunihiko Ishiguro , Tetsuya Mieda , Keiji Saito , Masami Aoyama , Toshimitsu Nakamura , Naoaki Mihara , Takumi Asanuma
IPC分类号： C09D125/08 , C09D193/04 , C09D109/06 , C09D123/22 , C08K5/01 , C08K5/56 , C08K5/057 , C08K5/00 , C08L53/02 , H01L51/52
CPC分类号： C09D125/08 , C08K5/0091 , C08K5/01 , C08K5/057 , C08K5/07 , C08K5/56 , C08L53/025 , C08L57/02 , C09D109/06 , C09D123/22 , C09D193/04 , H01L51/524
摘要： A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y
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公开(公告)号：US11139449B2
公开(公告)日：2021-10-05
申请号：US15280198
申请日：2016-09-29
发明人： Tetsuya Mieda , Kunihiko Ishiguro
IPC分类号： H01L51/52 , C08L23/22 , C08L53/02 , C08L45/00 , C08L9/02 , C08L9/06 , C09D109/02 , C09D109/06 , C09D123/22 , H01L51/00
摘要： A resin composition for sealing an organic electronic device element, containing a polyisobutylene resin (A), a hydrogenated cyclic olefin resin (B), and a polymer (C) obtained by any one of radical polymerization, anionic polymerization or coordination polymerization and exhibiting rubber elasticity, a resin sheet using the same, organic electroluminescent element, and image display apparatus.
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公开(公告)号：US10115904B2
公开(公告)日：2018-10-30
申请号：US14857335
申请日：2015-09-17
发明人： Kunihiko Ishiguro , Tetsuya Mieda
摘要： A transparent resin composition for organic EL element sealing and other things having a sufficient moisture blocking effect and excellent flexibility is provided. A thermoplastic resin, a tackifying resin, and an organometallic compound having at least an ester bond and represented by the following formula are included, and in which the light transmittance for light is 85% or higher, the relationship: AM/Y
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公开(公告)号：US09913324B2
公开(公告)日：2018-03-06
申请号：US14566961
申请日：2014-12-11
IPC分类号： B32B27/36 , H05B33/00 , H05B33/04 , C08J5/18 , C08G59/72 , C08L67/02 , C08G59/24 , H01L51/52
CPC分类号： H05B33/04 , B32B27/36 , C08G59/24 , C08G59/72 , C08J5/18 , C08L67/02 , H01L51/5253 , Y10T428/31511 , C08L63/00
摘要： A resin composition for sealing an organic electroluminescent element, containing: at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, in which the content of the epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the polyester resin.
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