A bump-on-trace interconnection structure utilizing a lower volume solder joint for joining a conductive metal pillar and a metal line trace includes a conductive metal pillar having a bonding surface having a width WP and a metal line trace, provided on a package substrate, having a top surface with a width WT, where WP is greater than WT. The solder joint is bonded to the bonding surface by wetting across the width WP and bonded predominantly only to the top surface of the metal line trace by wetting predominantly only to the top surface across the width WT.