公开(公告)号：US20210313287A1

公开(公告)日：2021-10-07

申请号：US17352844

申请日：2021-06-21

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Yu-Wei Lin ,  Sheng-Yu Wu ,  Yu-Jen Tseng ,  Tin-Hao Kuo ,  Chen-Shien Chen

IPC分类号： H01L23/00 ,  H01L21/48 ,  H01L21/768 ,  H01L25/065 ,  H01L25/00

摘要： An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal ladder bump mounted on the under bump metallurgy feature, the metal ladder bump having a first tapering profile, and a substrate trace mounted on a substrate, the substrate trace having a second tapering profile and coupled to the metal ladder bump through direct metal-to-metal bonding. An embodiment chip-to-chip structure may be fabricated in a similar fashion.

公开(公告)号：US11961810B2

公开(公告)日：2024-04-16

申请号：US17352844

申请日：2021-06-21

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Yu-Wei Lin ,  Sheng-Yu Wu ,  Yu-Jen Tseng ,  Tin-Hao Kuo ,  Chen-Shien Chen

IPC分类号： H01L21/48 ,  H01L21/768 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L24/02 ,  H01L21/4853 ,  H01L21/76885 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/14 ,  H01L2224/02125 ,  H01L2224/02141 ,  H01L2224/02145 ,  H01L2224/0215 ,  H01L2224/0401 ,  H01L2224/05114 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05647 ,  H01L2224/10125 ,  H01L2224/11013 ,  H01L2224/11019 ,  H01L2224/1112 ,  H01L2224/11462 ,  H01L2224/11472 ,  H01L2224/13005 ,  H01L2224/13012 ,  H01L2224/13015 ,  H01L2224/13017 ,  H01L2224/13023 ,  H01L2224/13026 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13551 ,  H01L2224/13564 ,  H01L2224/13565 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13686 ,  H01L2224/1369 ,  H01L2224/14051 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/16503 ,  H01L2224/81007 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/8181 ,  H01L2224/81895 ,  H01L2224/8192 ,  H01L2224/81948 ,  H01L2225/06513 ,  H01L2924/04941 ,  H01L2924/07025 ,  H01L2924/181 ,  H01L2924/301 ,  H01L2924/35 ,  Y10T29/49144 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2224/13144 ,  H01L2924/00014 ,  H01L2224/13155 ,  H01L2924/00014 ,  H01L2224/13166 ,  H01L2924/00014 ,  H01L2224/13164 ,  H01L2924/00014 ,  H01L2224/81447 ,  H01L2924/00014 ,  H01L2224/81444 ,  H01L2924/00014 ,  H01L2224/81439 ,  H01L2924/00014 ,  H01L2224/81424 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2924/014 ,  H01L2224/13116 ,  H01L2924/014 ,  H01L2224/13686 ,  H01L2924/05432 ,  H01L2224/13686 ,  H01L2924/053 ,  H01L2224/11462 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/13012 ,  H01L2924/00012 ,  H01L2224/13005 ,  H01L2924/206 ,  H01L2224/13005 ,  H01L2924/207

摘要： An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal ladder bump mounted on the under bump metallurgy feature, the metal ladder bump having a first tapering profile, and a substrate trace mounted on a substrate, the substrate trace having a second tapering profile and coupled to the metal ladder bump through direct metal-to-metal bonding. An embodiment chip-to-chip structure may be fabricated in a similar fashion.

公开(公告)号：US09917035B2

公开(公告)日：2018-03-13

申请号：US13658895

申请日：2012-10-24

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Yu-Jen Tseng ,  Yen-Liang Lin ,  Tin-Hao Kuo ,  Chen-Shien Chen ,  Mirng-Ji Lii

IPC分类号： H01L23/488 ,  H01L23/00

CPC分类号： H01L23/488 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13005 ,  H01L2224/13012 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13166 ,  H01L2224/13565 ,  H01L2224/13686 ,  H01L2224/16058 ,  H01L2224/16238 ,  H01L2224/81815 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/053 ,  H01L2924/206 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00

摘要： A bump-on-trace interconnection structure utilizing a lower volume solder joint for joining a conductive metal pillar and a metal line trace includes a conductive metal pillar having a bonding surface having a width WP and a metal line trace, provided on a package substrate, having a top surface with a width WT, where WP is greater than WT. The solder joint is bonded to the bonding surface by wetting across the width WP and bonded predominantly only to the top surface of the metal line trace by wetting predominantly only to the top surface across the width WT.