- 专利标题: Drum sputtering device
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申请号: US14424123申请日: 2013-08-21
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公开(公告)号: US09920419B2公开(公告)日: 2018-03-20
- 发明人: Shunsuke Ueda , Eisuke Haba
- 申请人: HITACHI CHEMICAL COMPANY, LTD.
- 申请人地址: JP Tokyo
- 专利权人: HITACHI CHEMICAL COMPANY, LTD.
- 当前专利权人: HITACHI CHEMICAL COMPANY, LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: Fitch, Even, Tabin & Flannery LLP
- 优先权: JP2012-189309 20120829
- 国际申请: PCT/JP2013/072307 WO 20130821
- 国际公布: WO2014/034497 WO 20140306
- 主分类号: C23C14/34
- IPC分类号: C23C14/34 ; C23C14/22 ; H01J37/34 ; C23C14/50 ; B22F1/02
摘要:
A drum sputtering device that can uniformly deposit target atoms on all over particles is provided. The drum sputtering device includes a vacuum container 2 that contains particles, a tubular drum 10 that is arranged inside the vacuum container 2 and at least one end face 10c of which is open, and a sputtering target 16 that is arranged inside the drum 10. With a supporting arm 11, a drive motor 12 for rotation, a drive motor 13 for swing, a first gear member 14, and a second gear member 15, the drum can be rotated around the axis of the drum 10 and the drum 10 can be swung so that one end portion 10e and the other end portion 10f in the axial direction of the drum 10 are relatively vertically switched.
公开/授权文献
- US20150307983A1 DRUM SPUTTERING DEVICE 公开/授权日:2015-10-29
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