Invention Grant
- Patent Title: Drum sputtering device
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Application No.: US14424123Application Date: 2013-08-21
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Publication No.: US09920419B2Publication Date: 2018-03-20
- Inventor: Shunsuke Ueda , Eisuke Haba
- Applicant: HITACHI CHEMICAL COMPANY, LTD.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Fitch, Even, Tabin & Flannery LLP
- Priority: JP2012-189309 20120829
- International Application: PCT/JP2013/072307 WO 20130821
- International Announcement: WO2014/034497 WO 20140306
- Main IPC: C23C14/34
- IPC: C23C14/34 ; C23C14/22 ; H01J37/34 ; C23C14/50 ; B22F1/02

Abstract:
A drum sputtering device that can uniformly deposit target atoms on all over particles is provided. The drum sputtering device includes a vacuum container 2 that contains particles, a tubular drum 10 that is arranged inside the vacuum container 2 and at least one end face 10c of which is open, and a sputtering target 16 that is arranged inside the drum 10. With a supporting arm 11, a drive motor 12 for rotation, a drive motor 13 for swing, a first gear member 14, and a second gear member 15, the drum can be rotated around the axis of the drum 10 and the drum 10 can be swung so that one end portion 10e and the other end portion 10f in the axial direction of the drum 10 are relatively vertically switched.
Public/Granted literature
- US20150307983A1 DRUM SPUTTERING DEVICE Public/Granted day:2015-10-29
Information query
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