Invention Grant
- Patent Title: Semiconductor manufacturing process and package carrier
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Application No.: US15141836Application Date: 2016-04-29
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Publication No.: US09922934B2Publication Date: 2018-03-20
- Inventor: Shih-Hui Wang , Chih-Hung Cheng , Yung-Chi Lin , Wen-Chih Chiou
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L23/544
- IPC: H01L23/544 ; G03F9/00 ; H01L21/683 ; H01L21/3105 ; H01L23/00
Abstract:
A package carrier includes a carrier and a light absorption layer. The light absorption layer is disposed on the carrier. The light absorption layer includes a notch at the periphery of the carrier, and the notch is light transmissive so as to expose the carrier to light in a normal direction of the carrier. A semiconductor manufacturing process is also provided.
Public/Granted literature
- US20170317033A1 SEMICONDUCTOR MANUFACTURING PROCESS AND PACKAGE CARRIER Public/Granted day:2017-11-02
Information query
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