公开(公告)号：US20210098330A1

公开(公告)日：2021-04-01

申请号：US16805869

申请日：2020-03-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Hui Wang ,  Der-Chyang Yeh ,  Shih-Peng Tai ,  Tsung-Shu Lin ,  Yi-Chung Huang

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/13 ,  H01L23/498

Abstract: A package structure including a substrate, a semiconductor device, a heat spreader, and an adhesive layer is provided. The semiconductor device is bonded onto the substrate, wherein an angle θ is formed between one sidewall of the semiconductor device and one sidewall of the substrate, 0°

公开(公告)号：US20170317033A1

公开(公告)日：2017-11-02

申请号：US15141836

申请日：2016-04-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Hui Wang ,  Chih-Hung Cheng ,  Yung-Chi Lin ,  Wen-Chih Chiou

IPC: H01L23/544 ,  H01L21/3105 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L21/3105 ,  H01L21/6835 ,  H01L24/11 ,  H01L2221/6835 ,  H01L2221/68359 ,  H01L2224/11002 ,  H01L2224/11005

Abstract: A package carrier includes a carrier and a light absorption layer. The light absorption layer is disposed on the carrier. The light absorption layer includes a notch at the periphery of the carrier, and the notch is light transmissive so as to expose the carrier to light in a normal direction of the carrier. A semiconductor manufacturing process is also provided.

公开(公告)号：US11289398B2

公开(公告)日：2022-03-29

申请号：US16805869

申请日：2020-03-02

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Hui Wang ,  Der-Chyang Yeh ,  Shih-Peng Tai ,  Tsung-Shu Lin ,  Yi-Chung Huang

IPC: H01L23/367 ,  H01L23/13 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065

Abstract: A package structure including a substrate, a semiconductor device, a heat spreader, and an adhesive layer is provided. The semiconductor device is bonded onto the substrate, wherein an angle θ is formed between one sidewall of the semiconductor device and one sidewall of the substrate, 0°

公开(公告)号：US09922934B2

公开(公告)日：2018-03-20

申请号：US15141836

申请日：2016-04-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Shih-Hui Wang ,  Chih-Hung Cheng ,  Yung-Chi Lin ,  Wen-Chih Chiou

IPC: H01L23/544 ,  G03F9/00 ,  H01L21/683 ,  H01L21/3105 ,  H01L23/00

CPC classification number: H01L21/3105 ,  H01L21/6835 ,  H01L24/11 ,  H01L2221/6835 ,  H01L2221/68359 ,  H01L2224/11002 ,  H01L2224/11005

Abstract: A package carrier includes a carrier and a light absorption layer. The light absorption layer is disposed on the carrier. The light absorption layer includes a notch at the periphery of the carrier, and the notch is light transmissive so as to expose the carrier to light in a normal direction of the carrier. A semiconductor manufacturing process is also provided.