- Patent Title: Integrated circuit and method for manufacturing integrated circuit
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Application No.: US15191412Application Date: 2016-06-23
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Publication No.: US09929206B2Publication Date: 2018-03-27
- Inventor: Bart Vereecke , Deniz Sabuncuoglu Tezcan , Philippe Soussan , Nicolaas Tack
- Applicant: IMEC VZW
- Applicant Address: BE Leuven
- Assignee: IMEC vzw
- Current Assignee: IMEC vzw
- Current Assignee Address: BE Leuven
- Agency: Knobbe, Martens, Olson & Bear LLP
- Priority: EP15174534 20150630
- Main IPC: H01L27/32
- IPC: H01L27/32 ; H01L27/146 ; G01J3/51 ; G01J3/50 ; G01J3/02 ; G01J3/12

Abstract:
An integrated circuit for an imaging device including an array of photo-sensitive areas is disclosed. In one aspect the integrated circuit includes a first multi-layer structure and a second multi-layer structure arranged over a first and a second photo-sensitive area, respectively. The second multi-layer structures each have a bottom and a top reflective structure and a spacer layer arranged therebetween. The spacer layer has a thickness such that the multi-layer structure selectively transmits a narrow range of wavelengths of electro-magnetic radiation. The bottom and top reflective structures include a stack of alternating layers of a first and a second material. Thickness and/or material of the alternating layers of the first multi-layer structure differ from thickness and/or material of the alternating layers of the second multi-layer structure.
Public/Granted literature
- US20170005132A1 INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING INTEGRATED CIRCUIT Public/Granted day:2017-01-05
Information query
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