- 专利标题: Source/drain regions for high electron mobility transistors (HEMT) and methods of forming same
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申请号: US15368346申请日: 2016-12-02
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公开(公告)号: US09929248B2公开(公告)日: 2018-03-27
- 发明人: Chun-Hsiang Fan , Chun-Hsiung Lin , Mao-Lin Huang
- 申请人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Slater Matsil, LLP
- 主分类号: H01L21/338
- IPC分类号: H01L21/338 ; H01L29/66 ; H01L29/417 ; H01L29/205 ; H01L21/306 ; H01L29/08 ; H01L29/423 ; H01L29/267 ; H01L29/778
摘要:
An embodiment high electron mobility transistor (HEMT) includes a gate electrode over a semiconductor substrate and a multi-layer semiconductor cap over the semiconductor substrate and adjacent the gate electrode. The multi-layer semiconductor cap includes a first semiconductor layer and a second semiconductor layer comprising a different material than the first semiconductor layer. The first semiconductor layer is laterally spaced apart from the gate electrode by a first spacing, and the second semiconductor layer is spaced apart from the gate electrode by a second spacing greater than the first spacing.
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