- 专利标题: Short circuit reduction in an electronic component comprising a stack of layers arranged on a flexible substrate
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申请号: US14128003申请日: 2012-06-21
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公开(公告)号: US09934836B2公开(公告)日: 2018-04-03
- 发明人: Christer Karlsson , Olle Jonny Hagel , Jakob Nilsson , Per Bröms
- 申请人: Christer Karlsson , Olle Jonny Hagel , Jakob Nilsson , Per Bröms
- 申请人地址: NO Oslo
- 专利权人: THIN FILM ELECTRONICS ASA
- 当前专利权人: THIN FILM ELECTRONICS ASA
- 当前专利权人地址: NO Oslo
- 代理机构: Moore & Van Allen PLLC
- 代理商 Michael G. Johnston
- 优先权: SE1150594 20110627; WOPCT/EP2011/060740 20110627
- 国际申请: PCT/EP2012/062025 WO 20120621
- 国际公布: WO2013/000825 WO 20130103
- 主分类号: H05K1/00
- IPC分类号: H05K1/00 ; G11C11/22 ; G11C13/00 ; H01L27/28 ; H01L51/05
摘要:
An electronic component (1) and an electronic device (100) comprising one or more such components (1). The electronic component (1) comprises a stack (4) of layers arranged on a flexible substrate (3). Said stack comprises an electrically active part (4a) and a protective layer (11) for protecting the electrically active part against scratches and abrasion. Said electrically active part comprises a bottom electrode layer (5) and a top electrode layer (9) and at least one insulating or semi-insulating layer (7) between said electrodes. The stack further comprises a buffer layer (13), arranged between the top electrode layer (9) and the protective layer (11). The buffer layer (13) is adapted for at least partially absorbing a lateral dimensional change (ΔL) occurring in the protective layer (11) and thus preventing said dimensional change (ΔL) from being transferred to the electrically active part (4a), thereby reducing the risk of short circuit to occur between the electrodes.
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