Transistor
    2.
    发明申请
    Transistor 失效
    晶体管

    公开(公告)号:US20070138463A1

    公开(公告)日:2007-06-21

    申请号:US11594995

    申请日:2006-11-09

    IPC分类号: H01L29/08 H01L31/00

    摘要: A fast organic field effect transistor (100), which operates at low voltages, is achieved by the introduction of an oligomeric or polymeric electrolyte (131) between the gate electrode (141) and the organic semiconductor layer (121), which electrolyte (131) has a dissociation constant of at least 10−8. Said organic semiconductor layer (121) is in contact with the source electrode (111) and the drain electrode (112) of the transistor. In operation a potential (152) applied to said gate electrode (141) controls the current A between said source electrode (111) and said drain electrode (112).

    摘要翻译: 通过在栅电极(141)和有机半导体层(121)之间引入低聚或高分子电解质(131)来实现在低电压下工作的快速有机场效应晶体管(100),该电解质 )具有至少10-8的解离常数。 所述有机半导体层(121)与晶体管的源电极(111)和漏电极(112)接触。 在操作中,施加到所述栅极(141)的电位(152)控制所述源电极(111)和所述漏电极(112)之间的电流A.

    Method for manufacturing an optoelectrical component and an
optoelectrical component manufactured according to the method
    3.
    发明授权
    Method for manufacturing an optoelectrical component and an optoelectrical component manufactured according to the method 失效
    根据该方法制造的光电元件和光电元件的制造方法

    公开(公告)号:US5930438A

    公开(公告)日:1999-07-27

    申请号:US931304

    申请日:1997-09-16

    CPC分类号: G02B6/30 G02B6/1221

    摘要: The optoelectrical components which up to now have been used in the fibre-optical region have had waveguides of quartz and glass with hermetic encapsulating, which components have had too high manufacturing costs for profitable use. Through making polymeric single mode (SM) waveguides from plastic, for example, benzocyclobutene polymer (BCB) a simple reliable and inexpensive concept for making waveguides can be obtained. Two of the commercially available grades of BCB/DOW Chemicals have furthermore a refractive index difference which permits manufacturing of buried waveguides with SM characteristics. These two types of BCB material have shown themselves to be especially usable for manufacturing of so-called buried SM waveguides: a heat curable grade (1,4) used for under- and over-cladding for waveguides and a photo-definable derivative (3) used as the waveguide material. Encapsulating of a waveguide chip can in this way be made with plastics, at the same time as the connector interface can be formed in the end surfaces of the components.

    摘要翻译: 目前已经在光纤区域中使用的光电组件已经具有石英和玻璃的波导,具有气密封装,这些部件具有太高的制造成本以获得有利的使用。 通过从塑料制造聚合单模(SM)波导,例如苯并环丁烯聚合物(BCB),可以获得制造波导的简单可靠且廉价的概念。 两种商业级BCB / DOW Chemicals还具有折射率差异,其允许制造具有SM特性的掩埋波导。 这两种类型的BCB材料已经显示出自己特别可用于制造所谓的掩埋SM波导:用于波导的低于和过度包覆的可热固化等级(1,4)和可光学定义的衍生物(3 )用作波导材料。 以这种方式,可以用塑料制造波导芯片的封装,同时可以在部件的端面中形成连接器接口。

    SHORT CIRCUIT REDUCTION IN AN ELECTRONIC COMPONENT COMPRISING A STACK OF LAYERS ARRANGED ON A FLEXIBLE SUBSTRATE
    5.
    发明申请
    SHORT CIRCUIT REDUCTION IN AN ELECTRONIC COMPONENT COMPRISING A STACK OF LAYERS ARRANGED ON A FLEXIBLE SUBSTRATE 有权
    在包含柔性基板上的堆叠层的电子元件中短路电路减少

    公开(公告)号:US20140216791A1

    公开(公告)日:2014-08-07

    申请号:US14128003

    申请日:2012-06-21

    IPC分类号: H05K1/16 H05K3/46 H05K1/02

    摘要: An electronic component (1) and an electronic device (100) comprising one or more such components (1). The electronic component (1) comprises a stack (4) of layers arranged on a flexible substrate (3). Said stack comprises an electrically active part (4a) and a protective layer (11) for protecting the electrically active part against scratches and abrasion. Said electrically active part comprises a bottom electrode layer (5) and a top electrode layer (9) and at least one insulating or semi-insulating layer (7) between said electrodes. The stack further comprises a buffer layer (13), arranged between the top electrode layer (9) and the protective layer (11). The buffer layer (13) is adapted for at least partially absorbing a lateral dimensional change (ΔL) occurring in the protective layer (11) and thus preventing said dimensional change (ΔL) from being transferred to the electrically active part (4a), thereby reducing the risk of short circuit to occur between the electrodes.

    摘要翻译: 电子部件(1)和包括一个或多个这样的部件(1)的电子设备(100)。 电子部件(1)包括布置在柔性基板(3)上的层(4)。 所述堆叠包括电活性部分(4a)和保护层(11),用于保护电活性部分免受划伤和磨损。 所述电活性部分包括底部电极层(5)和顶部电极层(9)以及所述电极之间的至少一个绝缘或半绝缘层(7)。 该堆叠还包括布置在顶部电极层(9)和保护层(11)之间的缓冲层(13)。 缓冲层(13)适于至少部分地吸收出现在保护层(11)中的横向尺寸变化(&Dgr; L),从而防止所述尺寸变化(&Dgr; L)转移到电活性部件 4a),从而降低在电极之间发生短路的风险。

    SHORT CIRCUIT REDUCTION IN A FERROELECTRIC MEMORY CELL COMPRISING A STACK OF LAYERS ARRANGED ON A FLEXIBLE SUBSTRATE
    6.
    发明申请
    SHORT CIRCUIT REDUCTION IN A FERROELECTRIC MEMORY CELL COMPRISING A STACK OF LAYERS ARRANGED ON A FLEXIBLE SUBSTRATE 有权
    在包含安装在柔性基板上的层叠的电介质存储单元中的短路电路减少

    公开(公告)号:US20140210026A1

    公开(公告)日:2014-07-31

    申请号:US14128011

    申请日:2011-06-27

    摘要: A ferroelectric memory cell (1) and a memory device (100) comprising one or more such cells (1). The ferroelectric memory cell comprises a stack (4) of layers arranged on a flexible substrate (3). Said stack comprises an electrically active part (4a) and a protective layer (11) for protecting the electrically active part against scratches and abrasion. Said electrically active part comprises a bottom electrode layer (5) and a top electrode layer (9) and at least one ferroelectric memory material layer (7) between said electrodes. The stack further comprises a buffer layer (13) arranged between the top electrode layer (9) and the protective layer (11). The buffer layer (13) is adapted for at least partially absorbing a lateral dimensional change (ΔL) occurring in the protective layer (11) and thus preventing said dimensional change (ΔL) from being transferred to the electrically active part (4a), thereby reducing the risk of short circuit to occur between the electrodes.

    摘要翻译: 铁电存储器单元(1)和包括一个或多个这样的单元(1)的存储器件(100)。 铁电存储单元包括布置在柔性基板(3)上的层叠层(4)。 所述堆叠包括电活性部分(4a)和保护层(11),用于保护电活性部分免受划伤和磨损。 所述电活性部分包括底电极层(5)和顶电极层(9)和在所述电极之间的至少一个铁电存储材料层(7)。 该堆叠还包括布置在顶部电极层(9)和保护层(11)之间的缓冲层(13)。 缓冲层(13)适于至少部分地吸收出现在保护层(11)中的横向尺寸变化(&Dgr; L),从而防止所述尺寸变化(&Dgr; L)转移到电活性部件 4a),从而降低在电极之间发生短路的风险。

    Optoelectric multichip module
    7.
    发明授权
    Optoelectric multichip module 失效
    光电多芯片模块

    公开(公告)号:US06343164B1

    公开(公告)日:2002-01-29

    申请号:US09263521

    申请日:1999-03-05

    IPC分类号: G02B613

    摘要: A thin-film multilayer structure on top of a substrate has three polymer layers having adapted refractive indices in which optical waveguides are formed. Signal conducting metal layers are located at these three thin-film layers. The metal is etched away at the waveguide cores so that ordinary optical waveguides of channel-type are obtained having a refractive index difference between the core and the cladding material. Holes are etched in the polymer layers in order to form electrical vias. Mirrors can be formed by laser ablating to provide connection of an optical waveguide to some component and to provide optical vias, in the case where another similar set of three polymer layers are applied on top of the layers shown. Hence, electrical and optical interconnections can be integrated in the multilayer structure using a minimum number of polymer layers and the optical waveguides can be constructed to have a low loss.

    摘要翻译: 在基板的顶部上的薄膜多层结构具有三个聚合物层,其中形成有光波导的具有适应的折射率。 信号导电金属层位于这三个薄膜层。 在波导芯处蚀刻金属,使得获得具有芯和包层材料之间的折射率差的通道型的普通光波导。 在聚合物层中蚀刻孔以形成电气通孔。 反射镜可以通过激光烧蚀形成,以提供光波导到某些部件的连接并提供光学通孔,在另一相似组的三个聚合物层被施加在所示的层的顶部上的情况下。 因此,可以使用最少数量的聚合物层将电气和光学互连集成在多层结构中,并且可以将光波导构造成具有低损耗。

    Read-Through Metal Tag and Methods of Making and Using the Same

    公开(公告)号:US20200266534A1

    公开(公告)日:2020-08-20

    申请号:US16790494

    申请日:2020-02-13

    IPC分类号: H01Q1/52 H04W4/80 H01Q1/22

    摘要: Embodiments of the disclosure pertain to a wireless communication device and a method of reading a wireless communication device in which the magnitude of electromagnetically-induced currents in a metal-containing substrate is reduced. The metal-containing substrate has one or more openings therethrough. The device includes an antenna configured to (i) receive one or more first wireless signals from a reader and (ii) transmit or broadcast one or more second wireless signals and an integrated circuit coupled to the antenna. The antenna overlaps with at least one of the one or more openings.