Invention Grant
- Patent Title: Microchip substance delivery devices having low-power electromechanical release mechanisms
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Application No.: US14483278Application Date: 2014-09-11
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Publication No.: US09937124B2Publication Date: 2018-04-10
- Inventor: S. Jay Chey , Bing Dang , John U. Knickerbocker , Kenneth F. Latzko , Joana Sofia Branquinho Teresa Maria , Lavanya Turlapati , Bucknell C. Webb , Steven L. Wright
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Ryan, Mason & Lewis, LLP
- Agent Louis J. Percello
- Main IPC: A61K9/00
- IPC: A61K9/00 ; A61M31/00 ; A61M5/142 ; A61M5/44 ; A61N1/04

Abstract:
Electromechanical substance delivery devices are provided which implement low-power electromechanical release mechanisms for controlled delivery of substances such as drugs and medication. For example, an electromechanical device includes a substrate having a cavity formed in a surface of the substrate, a membrane disposed on the surface of the substrate covering an opening of the cavity, and a seal disposed between the membrane and the surface of the substrate. The seal surrounds the opening of the cavity, and the seal and membrane are configured to enclose the cavity and retain a substance within the cavity. An electrode structure is configured to locally heat a portion of the membrane in response to a control voltage applied to the electrode structure, and create a stress that causes a rupture in the locally heated portion of the membrane to release the substance from within the cavity.
Public/Granted literature
- US20160074323A1 MICROCHIP SUBSTANCE DELIVERY DEVICES HAVING LOW-POWER ELECTROMECHANICAL RELEASE MECHANISMS Public/Granted day:2016-03-17
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