公开(公告)号：US10585119B2

公开(公告)日：2020-03-10

申请号：US15969468

申请日：2018-05-02

申请人： International Business Machines Corporation

发明人： Yang Liu ,  Steven L. Wright

IPC分类号： G01R1/073 ,  G01R31/28 ,  G01R31/04

摘要： A probe head that contains a coining surface and a plurality of probe tips integrated on a same side of the probe head is provided. The probe head has a first portion and a laterally adjacent second portion, wherein the first portion of the probe head contains the coining surface, and the second portion of the probe head contains the plurality of the probe tips. Each probe tip may, in some embodiments, extend outwards from a probe pedestal that is in contact with the second portion of the probe head. The probe head is traversed across the surface of a semiconductor wafer containing a plurality of solder bump arrays such that the coining surface contacts a specific array of solder bumps prior to contacting of the same specific array of solder bumps with the probe tips.

公开(公告)号：US20160240513A1

公开(公告)日：2016-08-18

申请号：US15137123

申请日：2016-04-25

申请人： International Business Machines Corporation

发明人： Bing Dang ,  John U. Knickerbocker ,  Yang Liu ,  Yu Luo ,  Steven L. Wright

IPC分类号： H01L25/065 ,  H01L23/31 ,  H01L23/50 ,  H01L23/00

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L21/6835 ,  H01L22/14 ,  H01L22/20 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3157 ,  H01L23/3178 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49894 ,  H01L23/50 ,  H01L24/11 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/11334 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/1701 ,  H01L2224/17104 ,  H01L2224/1712 ,  H01L2224/1751 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06565

摘要： A structure includes an electrical interconnection between a first substrate including a plurality of protrusions and a second substrate including a plurality of solder bumps, the plurality of protrusions includes sharp tips that penetrate the plurality of solder bumps, and a permanent electrical interconnection is established by physical contact between the plurality of protrusions and the plurality of solder bumps including a metallurgical joint.

摘要翻译： 一种结构包括在包括多个突起的第一基板和包括多个焊料凸块的第二基板之间的电互连，所述多个突起包括穿透多个焊料凸块的尖锐尖端，并且通过物理建立永久电互连 所述多个突起与所述多个焊料凸块之间的接触包括冶金接头。

公开(公告)号：US10940265B2

公开(公告)日：2021-03-09

申请号：US16435517

申请日：2019-06-09

申请人： International Business Machines Corporation

发明人： Bing Dang ,  John U. Knickerbocker ,  Joana S. B. T. Maria ,  Bucknell C. Webb ,  Steven L. Wright

IPC分类号： A61M5/168 ,  A61M5/142 ,  A61M5/44 ,  A61M5/172

摘要： A digital biomedical device includes a substrate forming a reservoir, a membrane comprising a first layer and a second layer having a strain therebetween, the membrane sealing the reservoir, and a controller configured to activate the membrane and release at least a portion of the strain causing the membrane curl and open the reservoir.

公开(公告)号：US20180252747A1

公开(公告)日：2018-09-06

申请号：US15969468

申请日：2018-05-02

申请人： International Business Machines Corporation

发明人： Yang Liu ,  Steven L. Wright

IPC分类号： G01R1/073

CPC分类号： G01R1/07364 ,  G01R1/07314 ,  G01R31/048 ,  G01R31/2886 ,  G01R31/2896 ,  G01R31/2898

摘要： A probe head that contains a coining surface and a plurality of probe tips integrated on a same side of the probe head is provided. The probe head has a first portion and a laterally adjacent second portion, wherein the first portion of the probe head contains the coining surface, and the second portion of the probe head contains the plurality of the probe tips. Each probe tip may, in some embodiments, extend outwards from a probe pedestal that is in contact with the second portion of the probe head. The probe head is traversed across the surface of a semiconductor wafer containing a plurality of solder bump arrays such that the coining surface contacts a specific array of solder bumps prior to contacting of the same specific array of solder bumps with the probe tips.

公开(公告)号：US20180133152A1

公开(公告)日：2018-05-17

申请号：US15852943

申请日：2017-12-22

申请人： International Business Machines Corporation

发明人： S. Jay Chey ,  Bing Dang ,  John U. Knickerbocker ,  Kenneth F. Latzko ,  Joana Sofia Branquinho Teresa Maria ,  Lavanya Turlapati ,  Bucknell C. Webb ,  Steven L. Wright

IPC分类号： A61K9/00 ,  A61N1/04 ,  A61M31/00

CPC分类号： A61K9/0097 ,  A61M31/002 ,  A61M2205/0244 ,  A61N1/0428 ,  A61N1/0444 ,  A61N1/0448

摘要： Electromechanical substance delivery devices are provided which implement low-power electromechanical release mechanisms for controlled delivery of substances such as drugs and medication. For example, an electromechanical device includes a substrate having a cavity formed in a surface of the substrate, a membrane disposed on the surface of the substrate covering an opening of the cavity, and a seal disposed between the membrane and the surface of the substrate. The seal surrounds the opening of the cavity, and the seal and membrane are configured to enclose the cavity and retain a substance within the cavity. An electrode structure is configured to locally heat a portion of the membrane in response to a control voltage applied to the electrode structure, and create a stress that causes a rupture in the locally heated portion of the membrane to release the substance from within the cavity.

公开(公告)号：US20170175280A1

公开(公告)日：2017-06-22

申请号：US15203869

申请日：2016-07-07

申请人： International Business Machines Corporation

发明人： Bing Dang ,  Yang Liu ,  Steven L. Wright

IPC分类号： C25D1/22 ,  C23C14/34 ,  C23C14/14 ,  B23K1/00 ,  A61B5/042 ,  A61B5/0478 ,  A61B5/00 ,  C25D1/00 ,  B05D1/00

CPC分类号： A61B5/0478 ,  A61B5/0022 ,  A61B5/0408 ,  A61B5/6833 ,  A61B5/6839 ,  A61B2562/0215 ,  A61B2562/028 ,  A61B2562/125 ,  A61N1/0492 ,  A61N1/0502 ,  C25D1/003 ,  G16H40/67

摘要： An apparatus includes a substrate mechanically and electrically connected on one side of the substrate to multiple metallic probes in one or more arrays and includes the multiple metallic probes in the one or more arrays. In a method, multiple pits may be formed in an array on a first substrate. The pits have a pyramidal shape. A release layer is formed on the first substrate and covers surfaces of the pits. Probe tips are formed in the pits on the first substrate. The probe tips are formed from rigid conductive material. Multiple pillars are formed from rigid conductive material. The pillars are electrically and mechanically connected to a second substrate and to the probe tips. Release is caused of the probe tips from the first substrate, wherein the pillars and probe tips are connected to the second substrate and together form an array of rigid and conductive probes.

公开(公告)号：US10314970B2

公开(公告)日：2019-06-11

申请号：US15859344

申请日：2017-12-30

申请人： International Business Machines Corporation

发明人： Bing Dang ,  John U. Knickerbocker ,  Joana S. B. T. Maria ,  Bucknell C. Webb ,  Steven L. Wright

IPC分类号： A61M5/168 ,  A61M5/142 ,  A61M5/44 ,  A61M5/172

摘要： A digital biomedical device includes a substrate forming a reservoir, a membrane comprising a first layer and a second layer having a strain therebetween, the membrane sealing the reservoir, and a controller configured to activate the membrane and release at least a portion of the strain causing the membrane curl and open the reservoir.

公开(公告)号：US09865569B2

公开(公告)日：2018-01-09

申请号：US15137123

申请日：2016-04-25

申请人： International Business Machines Corporation

发明人： Bing Dang ,  John U. Knickerbocker ,  Yang Liu ,  Yu Luo ,  Steven L. Wright

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L21/683 ,  H01L23/50 ,  H01L23/13 ,  H01L21/66 ,  H01L23/48

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L21/6835 ,  H01L22/14 ,  H01L22/20 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3157 ,  H01L23/3178 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49894 ,  H01L23/50 ,  H01L24/11 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/11334 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/1701 ,  H01L2224/17104 ,  H01L2224/1712 ,  H01L2224/1751 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06565

摘要： A structure includes an electrical interconnection between a first substrate including a plurality of protrusions and a second substrate including a plurality of solder bumps, the plurality of protrusions includes sharp tips that penetrate the plurality of solder bumps, and a permanent electrical interconnection is established by physical contact between the plurality of protrusions and the plurality of solder bumps including a metallurgical joint.

公开(公告)号：US20170363659A1

公开(公告)日：2017-12-21

申请号：US15185819

申请日：2016-06-17

申请人： International Business Machines Corporation

发明人： Yang Liu ,  Steven L. Wright

IPC分类号： G01R1/073

CPC分类号： G01R1/07364 ,  G01R1/07314 ,  G01R31/048 ,  G01R31/2886 ,  G01R31/2896 ,  G01R31/2898

摘要： A probe head that contains a coining surface and a plurality of probe tips integrated on a same side of the probe head is provided. The probe head has a first portion and a laterally adjacent second portion, wherein the first portion of the probe head contains the coining surface, and the second portion of the probe head contains the plurality of the probe tips. Each probe tip may, in some embodiments, extend outwards from a probe pedestal that is in contact with the second portion of the probe head. The probe head is traversed across the surface of a semiconductor wafer containing a plurality of solder bump arrays such that the coining surface contacts a specific array of solder bumps prior to contacting of the same specific array of solder bumps with the probe tips.

公开(公告)号：US09391040B2

公开(公告)日：2016-07-12

申请号：US14516963

申请日：2014-10-17

申请人： International Business Machines Corporation

发明人： Bing Dang ,  John U. Knickerbocker ,  Yang Liu ,  Yu Luo ,  Steven L. Wright

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L25/00 ,  H01L23/498 ,  H01L21/56 ,  H01L23/31 ,  H01L21/683 ,  H01L21/66

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L21/6835 ,  H01L22/14 ,  H01L22/20 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/3157 ,  H01L23/3178 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49894 ,  H01L23/50 ,  H01L24/11 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68359 ,  H01L2221/68381 ,  H01L2224/11334 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/1701 ,  H01L2224/17104 ,  H01L2224/1712 ,  H01L2224/1751 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2225/06555 ,  H01L2225/06565

摘要： A structure includes an electrical interconnection between a first substrate including a plurality of protrusions and a second substrate including a plurality of solder bumps, the plurality of protrusions includes sharp tips that penetrate the plurality of solder bumps, and a permanent electrical interconnection is established by physical contact between the plurality of protrusions and the plurality of solder bumps including a metallurgical joint.

摘要翻译： 一种结构包括在包括多个突起的第一基板和包括多个焊料凸块的第二基板之间的电互连，所述多个突起包括穿透多个焊料凸块的尖锐尖端，并且通过物理建立永久电互连 所述多个突起与所述多个焊料凸块之间的接触包括冶金接头。