- 专利标题: Semiconductor device and method of manufacturing semiconductor device
-
申请号: US15231966申请日: 2016-08-09
-
公开(公告)号: US09941127B2公开(公告)日: 2018-04-10
- 发明人: Bungo Tanaka , Norio Yasuhara
- 申请人: Kabushiki Kaisha Toshiba
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: White & Case LLP
- 优先权: JP2015-159647 20150812
- 主分类号: H01L27/148
- IPC分类号: H01L27/148 ; H01L29/80 ; H01L29/76 ; H01L21/28 ; H01L29/49 ; H01L29/66 ; H01L29/78 ; H01L29/423 ; H01L29/417 ; H01L29/739
摘要:
A semiconductor includes a first electrode, a first semiconductor region, a second semiconductor region, a third semiconductor region, and a gate electrode. The gate electrode has a first portion arranged with the second semiconductor region in a direction perpendicular to a first direction extending from the first electrode to the first semiconductor region, and has a second portion on the first portion. The semiconductor also includes a gate insulating layer between the gate electrode and each of the three semiconductor regions. The gate insulating layer extends to the upper surface of the third semiconductor region to form an extending portion. The second portion of the gate electrode protrudes in an upward direction from the upper surface of the extending portion of the gate insulating layer, and a lower part of the second portion of the gate electrode is embedded in the first portion of the gate electrode.
公开/授权文献
信息查询
IPC分类: