Invention Grant
- Patent Title: Multichip package link
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Application No.: US14669975Application Date: 2015-03-26
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Publication No.: US09946676B2Publication Date: 2018-04-17
- Inventor: Mahesh Wagh , Zuoguo Wu , Venkatraman Iyer , Gerald S. Pasdast , Mark S. Birrittella , Ishwar Agarwal , Lip Khoon Teh , Su Wei Lim , Anoop Kumar Upadhyay
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Alliance IP, LLC
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06F13/40 ; G06F13/36

Abstract:
A system-on-a-chip, such as a logical PHY, may be divided into hard IP blocks with fixed routing, and soft IP blocks with flexible routing. Each hard IP block may provide a fixed number of lanes. Using p hard IP blocks, where each block provides n data lanes, h=n*p total hard IP data lanes are provided. Where the system design calls for k total data lanes, it is possible that k≠h, so that ┌k/n┐ hard IP blocks provide h=n*p available hard IP data lanes. In that case, h−k lanes may be disabled. In cases where lane reversals occur, such as between hard IP and soft IP, bowtie routing may be avoided by the use of a multiplexer-like programmable switch within the soft IP.
Public/Granted literature
- US20160283429A1 MULTICHIP PACKAGE LINK Public/Granted day:2016-09-29
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