Invention Grant
- Patent Title: Die-bonding layer formation film, processed product having die-bonding layer formation film attached thereto, and semiconductor device
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Application No.: US15125705Application Date: 2015-03-16
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Publication No.: US09953946B2Publication Date: 2018-04-24
- Inventor: Yuichiro Azuma , Hideaki Suzuki , Naoya Saiki , Yuta Sagawa
- Applicant: LINTEC CORPORATION
- Applicant Address: JP Tokyo
- Assignee: LINTEC CORPORATION
- Current Assignee: LINTEC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Posz Law Group, PLC
- Priority: JP2014-054200 20140317
- International Application: PCT/JP2015/057704 WO 20150316
- International Announcement: WO2015/141629 WO 20150924
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/683 ; C09J7/02 ; C09J133/06 ; C09J133/12

Abstract:
A die-bonding layer formation film to be used for fixing a processed product to an adherend, includes an adhesive layer, wherein, the storage elastic modulus has a local minimum value at a temperature within a range of 80° C. to 150° C., wherein the adhesive layer has a shear strength to a peeling strength test substrate of 20 N/2 mm□ [N/(2 mm×2 mm)] or more and 50 N/2 mm□ [N/(2 mm×2 mm)] or less, wherein the shear strength is measured after the processed product is placed above the peeling strength test substrate via the die-bonding layer formation film and the die-bonding layer formation film on the peeling strength test substrate is heated at 175° C. for 1 hour and then further maintained under an environment of 250° C. for 30 seconds. Bubbles (voids) are unlikely to grow at the boundary between the adhesive layer and an adherend even when subjected to thermal history.
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