公开(公告)号：US09953946B2

公开(公告)日：2018-04-24

申请号：US15125705

申请日：2015-03-16

Applicant: LINTEC CORPORATION

Inventor： Yuichiro Azuma ,  Hideaki Suzuki ,  Naoya Saiki ,  Yuta Sagawa

IPC: H01L23/00 ,  H01L21/683 ,  C09J7/02 ,  C09J133/06 ,  C09J133/12

CPC classification number: H01L24/29 ,  C09J7/38 ,  C09J133/06 ,  C09J133/12 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/114 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68386 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2224/27 ,  H01L2924/0665 ,  H01L2224/45099

Abstract: A die-bonding layer formation film to be used for fixing a processed product to an adherend, includes an adhesive layer, wherein, the storage elastic modulus has a local minimum value at a temperature within a range of 80° C. to 150° C., wherein the adhesive layer has a shear strength to a peeling strength test substrate of 20 N/2 mm□ [N/(2 mm×2 mm)] or more and 50 N/2 mm□ [N/(2 mm×2 mm)] or less, wherein the shear strength is measured after the processed product is placed above the peeling strength test substrate via the die-bonding layer formation film and the die-bonding layer formation film on the peeling strength test substrate is heated at 175° C. for 1 hour and then further maintained under an environment of 250° C. for 30 seconds. Bubbles (voids) are unlikely to grow at the boundary between the adhesive layer and an adherend even when subjected to thermal history.

公开(公告)号：US20160086908A1

公开(公告)日：2016-03-24

申请号：US14888509

申请日：2014-05-27

Applicant: LINTEC CORPORATION

Inventor： Sayaka Tsuchiyama ,  Naoya Saiki ,  Yuichiro Azuma ,  Hideaki Suzuki

IPC: H01L23/00 ,  C09J133/10 ,  H01L25/00 ,  H01L21/78 ,  H01L21/683

CPC classification number: H01L24/29 ,  C08J3/242 ,  C08J2333/12 ,  C08K3/36 ,  C08K9/04 ,  C08L33/066 ,  C08L63/00 ,  C09J7/22 ,  C09J7/30 ,  C09J133/066 ,  C09J133/10 ,  C09J163/00 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/0635 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having a reactive double bond group, and a filler (C) having a reactive double bond group on a surface thereof. The acrylic polymer (A) has a weight average molecular weight of 500,000 or more, and the heat curable resin (B) comprises an epoxy resin and a heat curing agent, in which at least one of the epoxy resin and the heat curing agent has the reactive double bond group.

Abstract translation: 粘合剂组合物包括丙烯酸类聚合物（A），具有反应性双键基团的热固性树脂（B）和其表面具有反应性双键基团的填料（C）。 丙烯酸类聚合物（A）的重均分子量为50万以上，热固性树脂（B）包含环氧树脂和热固化剂，其中环氧树脂和热固化剂中的至少一种具有 反应性双键组。