公开(公告)号：US09953946B2

公开(公告)日：2018-04-24

申请号：US15125705

申请日：2015-03-16

Applicant: LINTEC CORPORATION

Inventor： Yuichiro Azuma ,  Hideaki Suzuki ,  Naoya Saiki ,  Yuta Sagawa

IPC: H01L23/00 ,  H01L21/683 ,  C09J7/02 ,  C09J133/06 ,  C09J133/12

CPC classification number: H01L24/29 ,  C09J7/38 ,  C09J133/06 ,  C09J133/12 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2205/114 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68386 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2224/27 ,  H01L2924/0665 ,  H01L2224/45099

Abstract: A die-bonding layer formation film to be used for fixing a processed product to an adherend, includes an adhesive layer, wherein, the storage elastic modulus has a local minimum value at a temperature within a range of 80° C. to 150° C., wherein the adhesive layer has a shear strength to a peeling strength test substrate of 20 N/2 mm□ [N/(2 mm×2 mm)] or more and 50 N/2 mm□ [N/(2 mm×2 mm)] or less, wherein the shear strength is measured after the processed product is placed above the peeling strength test substrate via the die-bonding layer formation film and the die-bonding layer formation film on the peeling strength test substrate is heated at 175° C. for 1 hour and then further maintained under an environment of 250° C. for 30 seconds. Bubbles (voids) are unlikely to grow at the boundary between the adhesive layer and an adherend even when subjected to thermal history.

公开(公告)号：US20160086908A1

公开(公告)日：2016-03-24

申请号：US14888509

申请日：2014-05-27

Applicant: LINTEC CORPORATION

Inventor： Sayaka Tsuchiyama ,  Naoya Saiki ,  Yuichiro Azuma ,  Hideaki Suzuki

IPC: H01L23/00 ,  C09J133/10 ,  H01L25/00 ,  H01L21/78 ,  H01L21/683

CPC classification number: H01L24/29 ,  C08J3/242 ,  C08J2333/12 ,  C08K3/36 ,  C08K9/04 ,  C08L33/066 ,  C08L63/00 ,  C09J7/22 ,  C09J7/30 ,  C09J133/066 ,  C09J133/10 ,  C09J163/00 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2221/68386 ,  H01L2224/27003 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/0635 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/27 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having a reactive double bond group, and a filler (C) having a reactive double bond group on a surface thereof. The acrylic polymer (A) has a weight average molecular weight of 500,000 or more, and the heat curable resin (B) comprises an epoxy resin and a heat curing agent, in which at least one of the epoxy resin and the heat curing agent has the reactive double bond group.

Abstract translation: 粘合剂组合物包括丙烯酸类聚合物（A），具有反应性双键基团的热固性树脂（B）和其表面具有反应性双键基团的填料（C）。 丙烯酸类聚合物（A）的重均分子量为50万以上，热固性树脂（B）包含环氧树脂和热固化剂，其中环氧树脂和热固化剂中的至少一种具有 反应性双键组。

公开(公告)号：US20160218077A1

公开(公告)日：2016-07-28

申请号：US15023702

申请日：2014-09-29

Applicant: LINTEC CORPORATION

Inventor： Yuichiro Azuma ,  Sayaka Tsuchiyama ,  Akio Kabuto

IPC: H01L23/00 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L24/29 ,  B32B7/12 ,  B32B27/08 ,  B32B27/16 ,  B32B27/20 ,  B32B27/22 ,  B32B27/308 ,  B32B2250/44 ,  B32B2457/14 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  H01L21/6836 ,  H01L23/295 ,  H01L23/3142 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2223/54486 ,  H01L2224/29083 ,  H01L2224/2919 ,  H01L2924/0002 ,  H01L2924/0635 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20643

Abstract: The present invention relates to a composite sheet for resin film formation composed of a pressure-sensitive adhesive sheet having a pressure-sensitive adhesive layer on a base and a heat curable film for resin film formation provided on the pressure-sensitive adhesive layer. The film for resin film formation includes a binder component having a reactive double bond group. The pressure-sensitive adhesive layer includes a non-energy ray curable pressure-sensitive adhesive composition or a cured product of an energy ray curable pressure-sensitive adhesive composition.

Abstract translation: 本发明涉及一种用于树脂膜形成的复合片材，其由在基底上具有压敏粘合剂层的压敏粘合片和用于树脂膜形成的热固化膜组成，该粘合片材设置在压敏粘合剂层上。 用于树脂膜形成的膜包括具有反应性双键基团的粘合剂组分。 压敏粘合剂层包括非能量射线固化型压敏粘合剂组合物或能量射线固化型压敏粘合剂组合物的固化产物。