Invention Grant
- Patent Title: III-V lasers with integrated silicon photonic circuits
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Application No.: US15188419Application Date: 2016-06-21
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Publication No.: US09966735B2Publication Date: 2018-05-08
- Inventor: Cheng-Wei Cheng , Frank R. Libsch , Tak H. Ning , Uzma Rana , Kuen-Ting Shiu
- Applicant: GLOBALFOUNDRIES Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Hoffman Warnick LLC
- Agent Michael LeStrange
- Main IPC: H01S5/00
- IPC: H01S5/00 ; H01S5/227 ; H01S5/026 ; H01S3/063 ; H01S3/23 ; H01S5/16 ; H01S5/20 ; H01S5/30 ; H01S5/125 ; H01S5/02 ; H01S5/10

Abstract:
III-V lasers integrated with silicon photonic circuits and methods for making the same include a three-layer semiconductor stack formed from III-V semiconductors on a substrate, where a middle layer has a lower bandgap than a top layer and a bottom layer; a mirror region monolithically formed at a first end of the stack, configured to reflect emitted light in the direction of the stack; and a waveguide region monolithically formed at a second end of the stack, configured to transmit emitted light.
Public/Granted literature
- US20160301192A1 III-V LASERS WITH INTEGRATED SILICON PHOTONIC CIRCUITS Public/Granted day:2016-10-13
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