Invention Grant
- Patent Title: Substrate processing method and substrate processing apparatus
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Application No.: US15178824Application Date: 2016-06-10
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Publication No.: US09970109B2Publication Date: 2018-05-15
- Inventor: Jun Yoshikawa , Motoshi Fukudome
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2015-120040 20150615
- Main IPC: H01L21/461
- IPC: H01L21/461 ; C23C16/455 ; C23C16/458 ; H01J37/32 ; H01L21/02
Abstract:
Disclosed is a substrate processing method including: placing a plurality of substrates on a rotary table in a processing container; and performing a processing on the substrates while rotating the rotary table. A dummy workpiece is disposed in a gap between the substrates placed on the rotary table.
Public/Granted literature
- US20160362789A1 SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2016-12-15
Information query
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