公开(公告)号：US09970109B2

公开(公告)日：2018-05-15

申请号：US15178824

申请日：2016-06-10

Applicant: Tokyo Electron Limited

Inventor： Jun Yoshikawa ,  Motoshi Fukudome

IPC: H01L21/461 ,  C23C16/455 ,  C23C16/458 ,  H01J37/32 ,  H01L21/02

CPC classification number: C23C16/45551 ,  C23C16/45542 ,  C23C16/4584 ,  H01J37/32715 ,  H01J37/32779 ,  H01J2237/3323 ,  H01L21/02164 ,  H01L21/02274 ,  H01L21/0228

Abstract: Disclosed is a substrate processing method including: placing a plurality of substrates on a rotary table in a processing container; and performing a processing on the substrates while rotating the rotary table. A dummy workpiece is disposed in a gap between the substrates placed on the rotary table.

公开(公告)号：US20160362789A1

公开(公告)日：2016-12-15

申请号：US15178824

申请日：2016-06-10

Applicant: Tokyo Electron Limited

Inventor： Jun Yoshikawa ,  Motoshi Fukudome

IPC: C23C16/455 ,  H01L21/02 ,  C23C16/34 ,  C23C16/458 ,  H01J37/32

CPC classification number: C23C16/45551 ,  C23C16/45542 ,  C23C16/4584 ,  H01J37/32715 ,  H01J37/32779 ,  H01J2237/3323 ,  H01L21/02164 ,  H01L21/02274 ,  H01L21/0228

Abstract: Disclosed is a substrate processing method including: placing a plurality of substrates on a rotary table in a processing container; and performing a processing on the substrates while rotating the rotary table. A dummy workpiece is disposed in a gap between the substrates placed on the rotary table.

Abstract translation: 公开了一种基板处理方法，包括：将多个基板放置在处理容器中的旋转台上; 并且在旋转所述旋转台的同时对所述基板进行处理。 虚拟工件设置在放置在转台上的基板之间的间隙中。

公开(公告)号：US11625518B2

公开(公告)日：2023-04-11

申请号：US17274739

申请日：2019-08-29

Applicant: Tokyo Electron Limited

Inventor： Kosuke Yamamoto ,  Motoshi Fukudome ,  Ken Itabashi ,  Naoshige Fushimi ,  Kazuyoshi Matsuzaki

IPC: G06F30/27 ,  G06F119/18 ,  G06N3/02

Abstract: A learning device for performing a machine learning based on a learning model using data input to an input layer, includes: a calculation part configured to calculate a predetermined number of features, in which simulation data as a result of simulating semiconductor manufacturing processes by setting environmental information inside a process vessel in which the semiconductor manufacturing processes are performed and using a predetermined component provided in the process vessel as a variable, and XY coordinates parallel to a plane of a wafer are associated with each other; and an input part configured to input the calculated predetermined number of features to the input layer.

公开(公告)号：US11281116B2

公开(公告)日：2022-03-22

申请号：US17204161

申请日：2021-03-17

Applicant: Tokyo Electron Limited

Inventor： Einosuke Tsuda ,  Daisuke Toriya ,  Satoshi Yonekura ,  Satoshi Takeda ,  Motoshi Fukudome ,  Kyoko Ikeda

IPC: G03B27/52 ,  G03F7/20

Abstract: The present invention provides a substrate stage and a substrate processing apparatus that appropriately control a temperature of a staging surface on which a substrate is placed. The substrate stage includes a stage base including a cooling surface therein, and a supply flow path forming member formed of a material having a lower thermal conductivity than that of the stage base and including cooling nozzles configured to spray a coolant toward the cooling surface.