Invention Grant
- Patent Title: Multilayer electronic component
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Application No.: US15264190Application Date: 2016-09-13
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Publication No.: US09972440B2Publication Date: 2018-05-15
- Inventor: Keisuke Okai , Makoto Endo , Yohei Noda , Hirobumi Tanaka , Tomomichi Gunji , Yui Sugiura , Hiroshi Shindo
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2015-182033 20150915
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/224 ; H01G4/232 ; H01G4/35 ; H01G4/12

Abstract:
A multilayer electronic component includes an element body having an internal electrode layer and a dielectric layer. These are substantially parallel to a plane including a first axis and a second axis and are alternately laminated along a third axis direction. Side surfaces facing each other in the first axis direction are respectively equipped with an insulating layer. End surfaces facing each other in the second axis direction are respectively equipped with an external electrode. An elastic modulus of the insulating layer is 12 GPa to 140 GPa.
Public/Granted literature
- US20170076864A1 MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2017-03-16
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