Invention Grant
- Patent Title: Semiconductor device and method for fabricating the same
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Application No.: US15232820Application Date: 2016-08-10
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Publication No.: US09972570B2Publication Date: 2018-05-15
- Inventor: Ming-Te Wei , Chun-Hsien Lin
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: CN201610555077 20160714
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/525 ; H01L21/8234 ; H01L21/033 ; H01L23/522 ; H01L21/768 ; H01L21/311

Abstract:
A method for fabricating semiconductor device is disclosed. First, a substrate is provided, and a first dielectric layer is formed on the substrate, in which a first conductor is embedded within the first dielectric layer. Next, a second dielectric layer is formed on the first dielectric layer, part of the second dielectric layer is removed to form a contact hole, and a lateral etching process is conducted to expand the contact hole to form a funnel-shaped opening. Next, a metal layer is formed in the funnel-shaped opening, and the metal layer is planarized to form a second conductor.
Public/Granted literature
- US20180019205A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2018-01-18
Information query
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