Invention Grant
- Patent Title: Mounting board having electronic components mounted on substrate using different solder ball configurations
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Application No.: US15630157Application Date: 2017-06-22
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Publication No.: US09980369B2Publication Date: 2018-05-22
- Inventor: Shunsuke Itakura
- Applicant: JOLED INC.
- Applicant Address: JP Tokyo
- Assignee: JOLED INC.
- Current Assignee: JOLED INC.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2016-128123 20160628
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H01L23/12 ; H01L23/13 ; H01L25/10 ; H01L27/02 ; H01L23/00

Abstract:
A mounting board includes: a first electronic component that includes first solder balls, one of the first solder balls being surrounded by at least three of the first solder balls; a first capacitor that includes a first power supply terminal and a first ground terminal; a second electronic component that includes second solder balls, each of the second solder balls not being surrounded by at least three of the second solder balls; and a second capacitor that includes a second power supply terminal and a second ground terminal. A distance from the first ground terminal to the first electronic component is less than or equal to a distance from the first power supply terminal to the first electronic component. A distance from the second power supply terminal to the second electronic component is less than or equal to a distance from the second ground terminal to the second electronic component.
Public/Granted literature
- US20170374733A1 MOUNTING BOARD Public/Granted day:2017-12-28
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