公开(公告)号：US11985773B2

公开(公告)日：2024-05-14

申请号：US17822684

申请日：2022-08-26

Applicant: JOLED INC.

Inventor： Hiroyuki Yamakita ,  Teruo Nanmoku ,  Masaki Kawasaki ,  Tetsuro Nakamura ,  Shunsuke Itakura

IPC: H05K5/02 ,  H05K7/20

CPC classification number: H05K5/02 ,  H05K7/20963

Abstract: Disclosed herein is a display device including a display panel having a display portion configured to display an image, a plate-shaped member having a first principal surface and a second principal surface, the display panel being disposed on a second principal surface side, the plate-shaped member including a screen portion disposed in a position corresponding to the display portion, an opaque frame member disposed at a peripheral edge of the screen portion, a bonding member that has transparency and is configured to bond the display panel and the plate-shaped member to each other, a holding member disposed on the second principal surface side of the plate-shaped member, and a fixing member configured to fix the frame member and the holding member to the plate-shaped member, the plate-shaped member further including a transparent peripheral edge portion disposed on an outside of the frame member.

公开(公告)号：US09980369B2

公开(公告)日：2018-05-22

申请号：US15630157

申请日：2017-06-22

Applicant: JOLED INC.

Inventor： Shunsuke Itakura

IPC: H05K1/02 ,  H01L23/12 ,  H01L23/13 ,  H01L25/10 ,  H01L27/02 ,  H01L23/00

CPC classification number: H05K1/0216 ,  H01L23/12 ,  H01L23/13 ,  H01L24/73 ,  H01L25/105 ,  H01L27/0207 ,  H01L27/0248

Abstract: A mounting board includes: a first electronic component that includes first solder balls, one of the first solder balls being surrounded by at least three of the first solder balls; a first capacitor that includes a first power supply terminal and a first ground terminal; a second electronic component that includes second solder balls, each of the second solder balls not being surrounded by at least three of the second solder balls; and a second capacitor that includes a second power supply terminal and a second ground terminal. A distance from the first ground terminal to the first electronic component is less than or equal to a distance from the first power supply terminal to the first electronic component. A distance from the second power supply terminal to the second electronic component is less than or equal to a distance from the second ground terminal to the second electronic component.

公开(公告)号：US10426034B2

公开(公告)日：2019-09-24

申请号：US15719811

申请日：2017-09-29

Applicant: JOLED INC.

Inventor： Shunsuke Itakura

IPC: H05K1/14 ,  H05K1/18 ,  G09G3/3225 ,  G09G3/20 ,  G06F3/14 ,  H01L25/065 ,  H01L27/32

Abstract: A circuit substrate module includes: a plurality of substrates which are arranged in a matrix, and on at least some of which circuit components are mounted; a plurality of first flexible substrates each of which is arranged between two adjacent substrates in a row direction among the plurality of substrates, and connects the two adjacent substrates; and a plurality of second flexible substrates each of which is arranged between two adjacent substrates in a column direction among the plurality of substrates, and connects the two adjacent substrates.

公开(公告)号：US10163789B2

公开(公告)日：2018-12-25

申请号：US15718619

申请日：2017-09-28

Applicant: JOLED INC.

Inventor： Shunsuke Itakura

IPC: H01L23/34 ,  H01L23/528 ,  H01L27/118 ,  H01L25/16 ,  H01L23/00 ,  G09G5/10 ,  H01L49/02 ,  H01L23/50 ,  H01L25/18

Abstract: Provided is a semiconductor device that includes: an integrated circuit (IC) chip including a terminal array that is a matrix of terminals arranged in at least seven rows and at least seven columns, the terminals including a reference terminal to which a reference voltage is applied; a capacitor electrically connected to the reference terminal; and a substrate including one main surface as a mounting surface on which the IC chip and the capacitor are mounted. The IC chip is an application specific integrated circuit (ASIC) chip or a field-programmable gate array (FPGA) chip. The reference terminal is disposed at a position within three rows or three columns from an outer edge of the terminal array.