发明授权
- 专利标题： Slurry, polishing fluid set, polishing fluid, and substrate polishing method using same
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申请号： US13575078申请日： 2011-01-20
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公开(公告)号： US09982177B2公开(公告)日： 2018-05-29
- 发明人: Tomohiro Iwano , Hirotaka Akimoto , Takenori Narita , Tadahiro Kimura , Daisuke Ryuzaki
- 申请人： Tomohiro Iwano , Hirotaka Akimoto , Takenori Narita , Tadahiro Kimura , Daisuke Ryuzaki
- 申请人地址： JP Tokyo
- 专利权人： HITACHI CHEMICAL COMPANY, LTD
- 当前专利权人： HITACHI CHEMICAL COMPANY, LTD
- 当前专利权人地址： JP Tokyo
- 代理机构： Fitch, Even, Tabin & Flannery, LLC
- 优先权： JPP2010-056281 20100312
- 国际申请： PCT/JP2011/050991 WO 20110120
- 国际公布： WO2011/111421 WO 20110915
- 主分类号： C09K3/14
- IPC分类号： C09K3/14 ; B24B37/04 ; H01L21/3105 ; C09G1/02
摘要：
A slurry includes abrasive grains and water, wherein the abrasive grains include tetravalent cerium hydroxide particles and produce light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with the content of the abrasive grains adjusted to 1.0 mass %. A polishing liquid includes abrasive grains, an additive and water, wherein the abrasive grains include tetravalent cerium hydroxide particles and produce light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with the content of the abrasive grains adjusted to 1.0 mass %.