Invention Grant
- Patent Title: Test socket for testing semiconductor chip package and method of manufacturing the same
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Application No.: US14743163Application Date: 2015-06-18
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Publication No.: US09983229B2Publication Date: 2018-05-29
- Inventor: Jong-won Han , Jong-woo Lee , Young-gi Min , Soon-won Lee , Yong-in Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP
- Priority: KR10-2014-0142778 20141021
- Main IPC: G01R31/00
- IPC: G01R31/00 ; G01R1/04 ; H01R24/20 ; H01B1/02 ; H01B1/04 ; H01R13/03 ; G01R31/26 ; H01R13/24 ; H01R107/00

Abstract:
A test socket is provided that includes a base material including an insulating elastic material and a conductive portion extending through the base material in a thickness direction of the base material, wherein the conductive portion includes a plurality of conductive particle structures arranged in the thickness direction of the base material, and each of the plurality of conductive particle structures includes a plurality of conductive particles having at least one insulating wire and/or at least one conductive wire extending from a surface of the conductive particle, bonded with a material having a functional group.
Public/Granted literature
- US20160109480A1 TEST SOCKET FOR TESTING SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2016-04-21
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