Invention Grant
- Patent Title: Method of manufacturing a structure on a substrate
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Application No.: US15270422Application Date: 2016-09-20
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Publication No.: US09983480B2Publication Date: 2018-05-29
- Inventor: Daisuke Yajima
- Applicant: USHIO DENKI KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: USHIO DENKI KABUSHIKI KAISHA
- Current Assignee: USHIO DENKI KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2015-187429 20150924
- Main IPC: G03H1/04
- IPC: G03H1/04 ; G03F7/22 ; G03F1/50 ; G03F7/20 ; G03H1/02 ; G03F7/16 ; G03F7/26

Abstract:
A method includes dividing a single beam emitted from a coherent light source into at least two branch beams, and causing the branch beams to cross each other at a predetermined interference angle thereby generating interference pattern. The method also includes irradiating a target surface of a substrate with the interference pattern. The method also includes dividing the target surface of the substrate into a plurality of predetermined shapes, and repeating a first substep of irradiating each predetermined shape with every shot of the interference pattern, and a second substep of conveying the substrate in a stepwise manner such that the predetermined shapes overlap each other in the stepwise manner. The method also includes causing a line-to-line pitch of the interference fringes in one of the predetermined shapes to align with the line-to-line pitch of the interference fringes in a next predetermined shape upon repeating the first and second substeps.
Public/Granted literature
- US20170090289A1 METHOD OF MANUFACTURING A STRUCTURE ON A SUBSTRATE Public/Granted day:2017-03-30
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