Invention Grant
- Patent Title: Method of applying a transfer film to metal surfaces
-
Application No.: US15021476Application Date: 2013-10-31
-
Publication No.: US09983622B2Publication Date: 2018-05-29
- Inventor: Chung-Hung Huang , Yu-Chuan Kang , Chien-Ting Lin , Kuan-Ting Wu
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HPI Patent Department
- International Application: PCT/US2013/067734 WO 20131031
- International Announcement: WO2015/065420 WO 20150507
- Main IPC: G06F1/16
- IPC: G06F1/16 ; B32B1/02 ; C25D11/02 ; B32B15/08 ; C25D11/04 ; C25D11/10 ; C25D11/26 ; C25D11/30 ; H04M1/02
Abstract:
A method is provided for applying a transfer film to a metal surface. The method comprises electrochemically treating the metal to form an oxide layer, on to which a transfer film is applied.
Public/Granted literature
- US20160231775A1 Method of applying a Transfer Film to Metal Surfaces Public/Granted day:2016-08-11
Information query
