Invention Grant
- Patent Title: Method and apparatus for separating semiconductor devices from a wafer
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Application No.: US14949691Application Date: 2015-11-23
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Publication No.: US09984927B2Publication Date: 2018-05-29
- Inventor: Mathias Vaupel , Kurt Gehrig , Kian Pin Queck
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: B32B43/00
- IPC: B32B43/00 ; H01L21/78 ; H01L21/67 ; H01L21/683
Abstract:
An embodiment method for separating semiconductor devices from a wafer comprises using a carrier which acts an adjustable adhesive force upon the semiconductor devices and removing the semiconductor devices from the carrier by applying a mechanical or acoustical impulse to the carrier.
Public/Granted literature
- US20170117183A1 METHOD AND APPARATUS FOR SEPARATING SEMICONDUCTOR DEVICES FROM A WAFER Public/Granted day:2017-04-27
Information query
