Invention Grant
- Patent Title: High-voltage metal-oxide-semiconductor transistor and fabrication method thereof
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Application No.: US15820467Application Date: 2017-11-22
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Publication No.: US09985129B2Publication Date: 2018-05-29
- Inventor: Shih-Yin Hsiao , Kuan-Liang Liu , Ching-Chung Yang , Kai-Kuen Chang , Ping-Hung Chiang , Nien-Chung Li , Wen-Fang Lee , Chih-Chung Wang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: TW105116152A 20160524
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L29/78 ; H01L29/10 ; H01L29/66 ; H01L29/423 ; H01L29/06 ; H01L21/033

Abstract:
A high-voltage MOS transistor includes a semiconductor substrate, a gate oxide layer on the semiconductor substrate, a gate on the gate oxide layer, a spacer covering a sidewall of the gate, a source on one side of the gate, and a drain on the other side of the gate. The gate includes at least a first discrete segment and a second discrete segment. The first discrete segment is not in direct contact with the second discrete segment. The spacer fills into a gap between the first discrete segment and the second discrete segment.
Public/Granted literature
- US20180097104A1 HIGH-VOLTAGE METAL-OXIDE-SEMICONDUCTOR TRANSISTOR AND FABRICATION METHOD THEREOF Public/Granted day:2018-04-05
Information query
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