- 专利标题: Doped protection layer for contact formation
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申请号: US15584650申请日: 2017-05-02
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公开(公告)号: US09991123B2公开(公告)日: 2018-06-05
- 发明人: Mei-Chun Chen , Ching-Chen Hao , Wen-Hsin Chan , Chao-Jui Wang
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFATURING CO., LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFATURING CO., LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H01L21/28 ; H01L21/311 ; H01L21/3115 ; H01L21/768 ; H01L23/485 ; H01L29/40 ; H01L29/66 ; H01L29/78 ; H01L29/51
摘要:
A semiconductor device is provided. The semiconductor device includes a semiconductor substrate including a first doped region and a second doped region and a gate stack on the semiconductor substrate. The semiconductor device also includes a main spacer layer on a sidewall of the gate stack and a protection layer between the main spacer layer and the semiconductor substrate. The protection layer is doped with a quadrivalent element. The semiconductor device further includes an insulating layer formed over the semiconductor substrate and the gate stack and a contact formed in the insulating layer. The contact includes a first portion contacting the first doped region, and the contact includes a second portion contacting the second doped region. The first portion extends deeper into the semiconductor substrate than the second portion.
公开/授权文献
- US20170236716A1 DOPED PROTECTION LAYER FOR CONTACT FORMATION 公开/授权日:2017-08-17
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