Invention Grant
- Patent Title: Doped protection layer for contact formation
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Application No.: US15584650Application Date: 2017-05-02
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Publication No.: US09991123B2Publication Date: 2018-06-05
- Inventor: Mei-Chun Chen , Ching-Chen Hao , Wen-Hsin Chan , Chao-Jui Wang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFATURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFATURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/28 ; H01L21/311 ; H01L21/3115 ; H01L21/768 ; H01L23/485 ; H01L29/40 ; H01L29/66 ; H01L29/78 ; H01L29/51

Abstract:
A semiconductor device is provided. The semiconductor device includes a semiconductor substrate including a first doped region and a second doped region and a gate stack on the semiconductor substrate. The semiconductor device also includes a main spacer layer on a sidewall of the gate stack and a protection layer between the main spacer layer and the semiconductor substrate. The protection layer is doped with a quadrivalent element. The semiconductor device further includes an insulating layer formed over the semiconductor substrate and the gate stack and a contact formed in the insulating layer. The contact includes a first portion contacting the first doped region, and the contact includes a second portion contacting the second doped region. The first portion extends deeper into the semiconductor substrate than the second portion.
Public/Granted literature
- US20170236716A1 DOPED PROTECTION LAYER FOR CONTACT FORMATION Public/Granted day:2017-08-17
Information query
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