- 专利标题： Enhanced adhesive materials and processes for 3D applications
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申请号： US14967353申请日： 2015-12-13
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公开(公告)号： US09994741B2公开(公告)日： 2018-06-12
- 发明人: James L. Hedrick , Robert Dennis Miller , Deborah Ann Neumayer , Sampath Purushothaman , Mary E. Rothwell , Willi Volksen , Roy R. Yu
- 申请人： James L. Hedrick , Robert Dennis Miller , Deborah Ann Neumayer , Sampath Purushothaman , Mary E. Rothwell , Willi Volksen , Roy R. Yu
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 代理商 Thomas A. Beck; Daniel P. Morris
- 主分类号： C08K3/04
- IPC分类号： C08K3/04 ; C09J9/00 ; H01L25/065 ; H01L25/00 ; H01L23/00 ; C09J11/04 ; C09J11/06 ; C09J179/08 ; C09J179/04 ; C09J183/04 ; B82Y30/00 ; B82Y40/00 ; C08K7/24 ; C08K5/5425 ; C08K5/5465 ; C08K5/548 ; C08K5/544
摘要：
The present invention relates to CNT filled polymer composite system possessing a high thermal conductivity and high temperature stability so that it is a highly thermally conductive for use in 3D and 4D integration for joining device sub-laminate layers. The CNT/polymer composite also has a CTE close to that of Si, enabling a reduced wafer structural warping during high temperature processing cycling. The composition is tailored to be suitable for coating, curing and patterning by means conventionally known in the art.
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