Methods and devices for selective deposition of materials including mechanical abrasion
摘要:
Methods for depositing materials on patterned substrates, and related devices, are generally provided. In some embodiments, a material is deposited on a patterned substrate. In certain embodiments, the substrate comprises a first portion with a material deposited on the first portion and a second portion of the substrate essentially free of the material. The methods described herein may be useful in fabricating sensors, circuits, tags, among other devices. In some cases, devices for determining analytes are also provided.
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