Invention Grant
- Patent Title: Diode structure
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Application No.: US14989814Application Date: 2016-01-07
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Publication No.: US09997643B2Publication Date: 2018-06-12
- Inventor: Ke-Feng Lin , Hsuan-Po Liao , Ming-Shun Hsu , Chih-Chung Wang , Chiu-Te Lee , Shih-Teng Huang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: TW104140913A 20151207
- Main IPC: H01L29/02
- IPC: H01L29/02 ; H01L29/861 ; H01L29/06

Abstract:
A diode structure includes a rectangular first doping region, and a second doping region surrounds the first doping region wherein the first doping region and the second doping region are separated by a first isolation structure. A third doping region surrounds the second doping region wherein the second doping region and the third doping region are separated by a second isolation structure. The first isolation structure, the second doping region, the second isolation structure and the third doping region are arranged in a quadruple concentric rectangular ring surrounding the first doping region.
Public/Granted literature
- US20170162721A1 DIODE STRUCTURE Public/Granted day:2017-06-08
Information query
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