A method for producing a predetermined resist pattern on for example a lithographic printing plate, circuit board or mask, comprises the imagewise exposure of a radiation sensitive positive working coating using a suitable radiation such as direct heat radiation, UV radiation, visible radiation, infrared radiation or electron beam radiation. The method is characterised by the use of a novel polymeric material which is functionalised by groups Q to render it insoluble in a developer, but such that exposure to the radiation renders it soluble therein. The groups Q are not diazide groups as is conventional, but are groups which do not release nitrogen on exposure to the radiation, and have hydrogen bonding capability. Examples of groups Q are 2-naphthylsulphonyloxy, 2-thienylsulphonyloxy, dansyloxy, p-toluenesulphonyloxy, benzoyloxy and n-butylsulphonyloxy.